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Recently, SoftBank and Intel have jointly developed a new AI-specific memory chip aimed at significantly reducing power consumption to provide more efficient support for Japan's AI infrastructure. According to Nikkei Asia, the goal of their cooperation is to design a new type of stacked DRAM chip. The wiring method of this chip will be different from the popular High Bandwidth Memory (HBM) on the market, expected to reduce power consumption by about 50%. Image source note: The image was generated by AI, and the image rights service provider is Midjourney.

The JEDEC Solid State Technology Association has announced the highly anticipated release of the High Bandwidth Memory (HBM) standard – HBM4. Evolving from the HBM3 standard, HBM4 aims to further accelerate data processing while maintaining higher bandwidth, energy efficiency, and greater capacity per chip or stack, to meet the demands of efficient processing of large datasets and complex computations. The HBM4 standard introduces several key technological advancements, suitable for applications in generative AI, high-performance computing, high-end graphics cards, and servers. Firstly, HBM4 significantly increases bandwidth...

The Wikimedia Foundation has warned of increasing bandwidth strain on its projects caused by AI-powered web crawlers. Representatives noted a 50% increase in bandwidth consumption for multimedia files since January 2024, largely attributed to automated programs harvesting content from Wikimedia's openly licensed image library for AI model training. Wikimedia Foundation staff members Birgit Mueller, Chris Danis, and...

At the recent CES event, NVIDIA CEO Jensen Huang pointed out that Samsung Electronics is facing some difficulties in the production of new AI memory chips. These new memory chips, known as High Bandwidth Memory (HBM), are crucial for the next generation of AI systems powered by NVIDIA chips. Huang mentioned at the press conference that Samsung's production speed for HBM is slower compared to its competitor SK Hynix.

Ampere Inc. has announced a significant update to its product roadmap with the launch of its flagship processor, Aurora, designed for AI acceleration and high bandwidth memory integration, aiming to greatly enhance cloud-native AI computing performance. Aurora features 512 Ampere cores, offering more than three times the performance of existing processors, specifically engineered for AI training and inference workloads, demonstrating Ampere's ambitions in the AI computing space. Aurora utilizes scalable AmpereOn technology.

Samsung's third-quarter profit is expected to decline by 80% compared to the same period last year, with the chip division facing losses. Samsung continues to cut chip production to address the global oversupply issue. However, the demand for artificial intelligence high bandwidth memory chips remains robust. The mobile division shows decent performance in the third quarter, driven by the new foldable smartphones. Analysts predict that demand for memory chips may start to recover as early as early next year.